中信日本半導體
0095413.10−1.11−7.81%收盤・資料日 2026-11-06
資券概況資料日 2026-11-06
- 融資餘額2,100張增減−164
- 融券餘額0張增減−10
- 券資比0.00%
- 借券賣出餘額4,716張增減0
K 線與資券近 120 個交易日；單位：張
資券明細近 30 個交易日；單位：張
| 日期 | 資餘 | 資增 | 券餘 | 券增 | 券資比 | 當沖率 |
|---|---|---|---|---|---|---|
| 2026-11-06 | 2,100 | −164 | 0 | −10 | 0.00% | 12.6% |
| 2026-11-05 | 2,264 | +162 | 10 | +5 | 0.44% | 14.4% |
| 2026-11-04 | 2,102 | +65 | 5 | +5 | 0.24% | 17.1% |
| 2026-11-03 | 2,037 | −26 | 0 | 0 | 0.00% | 5.1% |
| 2026-11-02 | 2,063 | +87 | 0 | 0 | 0.00% | 20.8% |
| 2026-10-30 | 1,976 | +272 | 0 | −1 | 0.00% | 16.4% |
| 2026-10-29 | 1,704 | −80 | 1 | −7 | 0.06% | 23.1% |
| 2026-10-28 | 1,784 | −74 | 8 | +8 | 0.45% | 5.5% |
| 2026-10-27 | 1,858 | −8 | 0 | 0 | 0.00% | 8.5% |
| 2026-10-22 | 1,866 | +217 | 0 | 0 | 0.00% | 5.7% |
| 2026-10-21 | 1,649 | +161 | 0 | −2 | 0.00% | 5.8% |
| 2026-10-20 | 1,488 | +60 | 2 | −2 | 0.13% | 10.3% |
| 2026-10-19 | 1,428 | +15 | 4 | +1 | 0.28% | 4.2% |
| 2026-10-16 | 1,413 | +52 | 3 | 0 | 0.21% | 14.6% |
| 2026-10-15 | 1,361 | +214 | 3 | +1 | 0.22% | 8.3% |
| 2026-10-14 | 1,147 | −108 | 2 | −1 | 0.17% | 1.8% |
| 2026-10-13 | 1,255 | −142 | 3 | −40 | 0.24% | 7.1% |
| 2026-10-12 | 1,397 | −12 | 43 | +1 | 3.08% | 0.8% |
| 2026-10-08 | 1,409 | −17 | 42 | +3 | 2.98% | 6.5% |
| 2026-10-07 | 1,426 | −246 | 39 | 0 | 2.73% | 5.3% |
| 2026-10-06 | 1,672 | +7 | 39 | 0 | 2.33% | 12.6% |
| 2026-10-05 | 1,665 | +14 | 39 | −3 | 2.34% | 1.2% |
| 2026-10-02 | 1,651 | −13 | 42 | −2 | 2.54% | 2.9% |
| 2026-10-01 | 1,664 | −198 | 44 | +39 | 2.64% | 3.1% |
| 2026-09-30 | 1,862 | +1 | 5 | +1 | 0.27% | 0.8% |
| 2026-09-29 | 1,861 | −54 | 4 | +4 | 0.21% | 8.2% |
| 2026-09-24 | 1,915 | −24 | 0 | 0 | 0.00% | 1.3% |
| 2026-09-23 | 1,939 | +230 | 0 | 0 | 0.00% | 10.0% |
| 2026-09-22 | 1,709 | −23 | 0 | 0 | 0.00% | 2.9% |
| 2026-09-21 | 1,732 | −15 | 0 | 0 | 0.00% | 1.5% |