股溜產業平台

惠普

8424上櫃
67.3−0.5−0.74%收盤・資料日 2026-11-06

資券概況資料日 2026-11-06

  • 融資餘額5張增減0
  • 融券餘額0張增減0
  • 券資比0.00%
  • 借券賣出餘額19張增減0

K 線與資券近 120 個交易日;單位:張

資券明細近 30 個交易日;單位:張

日期資餘資增券餘券增券資比當沖率
2026-11-0650000.00%3.7%
2026-11-0550000.00%0.0%
2026-11-0450000.00%0.0%
2026-11-0350000.00%0.0%
2026-11-0250000.00%0.0%
2026-10-3050000.00%0.0%
2026-10-2950000.00%0.0%
2026-10-2850000.00%10.4%
2026-10-2750000.00%95.2%
2026-10-2250000.00%0.0%
2026-10-2150000.00%0.0%
2026-10-2050000.00%0.0%
2026-10-1950000.00%0.0%
2026-10-165+2000.00%0.0%
2026-10-1530000.00%0.0%
2026-10-1430000.00%0.0%
2026-10-1330000.00%0.0%
2026-10-1230000.00%3.9%
2026-10-0830000.00%13.3%
2026-10-0730000.00%0.0%
2026-10-0630000.00%0.0%
2026-10-0530000.00%0.0%
2026-10-0230000.00%0.0%
2026-09-3030000.00%27.4%
2026-09-2930000.00%10.7%
2026-09-2430000.00%19.0%
2026-09-2330000.00%0.0%
2026-09-2230000.00%14.1%
2026-09-2130000.00%0.0%
2026-09-1830000.00%—

股溜產業平台 產業資訊整理,不構成投資建議;數字以證交所、櫃買中心、集保公告為準。 資料日 2026-11-06