股溜產業平台

昇陽半導體

8028上市
178.5−15.5−7.99%收盤・資料日 2026-11-06

資券概況資料日 2026-11-06

  • 融資餘額7,054張增減−167
  • 融券餘額29張增減+4
  • 券資比0.41%
  • 借券賣出餘額14,349張增減0

K 線與資券近 120 個交易日;單位:張

資券明細近 30 個交易日;單位:張

日期資餘資增券餘券增券資比當沖率
2026-11-067,054−16729+40.41%35.9%
2026-11-057,221−31225−110.35%42.4%
2026-11-047,533−14236+20.48%41.3%
2026-11-037,675−3753400.44%38.8%
2026-11-028,050+534−110.42%53.7%
2026-10-308,045+145−90.56%33.6%
2026-10-298,044+9754+150.67%43.2%
2026-10-287,947+13739−50.49%34.6%
2026-10-277,810−9244+70.56%42.2%
2026-10-227,902+1437−180.47%42.5%
2026-10-217,888−6655−20.70%35.5%
2026-10-207,954−3457+60.72%38.7%
2026-10-197,988+42951+120.64%43.3%
2026-10-167,559−2739+30.52%32.8%
2026-10-157,586−16736−500.47%28.7%
2026-10-147,753+14786+11.11%45.3%
2026-10-137,606−37085−51.12%39.7%
2026-10-127,976−16490−31.13%40.6%
2026-10-088,140+19893−51.14%34.4%
2026-10-077,942−9998+11.23%44.7%
2026-10-068,041−20497−241.21%34.3%
2026-10-058,245+22121−121.47%32.4%
2026-10-028,223+52133+81.62%39.4%
2026-10-018,171+16125−131.53%33.0%
2026-09-308,155−335138−321.69%37.7%
2026-09-298,490+848170+522.00%54.9%
2026-09-247,642+252118+131.54%39.6%
2026-09-237,390+110105−361.42%29.5%
2026-09-227,280+39141+81.94%45.8%
2026-09-217,241+150133+541.84%41.5%

股溜產業平台 產業資訊整理,不構成投資建議;數字以證交所、櫃買中心、集保公告為準。 資料日 2026-11-06