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矽統

2363上市

41.65−2.40−5.45%收盤・資料日 2026-11-06

資券概況資料日 2026-11-06

融資餘額15,912張增減−937
融券餘額220張增減+78
券資比1.38%
借券賣出餘額43,007張增減+346連增 5 日

K 線與資券近 120 個交易日；單位：張

資券明細近 30 個交易日；單位：張

日期	資餘	資增	券餘	券增	券資比	當沖率
2026-11-06	15,912	−937	220	+78	1.38%	38.5%
2026-11-05	16,849	−30	142	+98	0.84%	26.8%
2026-11-04	16,879	−261	44	−2	0.26%	43.1%
2026-11-03	17,140	−22	46	−40	0.27%	22.2%
2026-11-02	17,162	−1	86	+56	0.50%	44.4%
2026-10-30	17,163	−109	30	−34	0.17%	30.0%
2026-10-29	17,272	−366	64	+3	0.37%	32.4%
2026-10-28	17,638	−164	61	+21	0.35%	39.7%
2026-10-27	17,802	−126	40	−34	0.22%	33.5%
2026-10-22	17,928	+30	74	−2	0.41%	29.4%
2026-10-21	17,898	+104	76	0	0.42%	36.0%
2026-10-20	17,794	−23	76	−6	0.43%	33.9%
2026-10-19	17,817	+54	82	−2	0.46%	39.4%
2026-10-16	17,763	−127	84	+6	0.47%	31.7%
2026-10-15	17,890	−27	78	+19	0.44%	25.7%
2026-10-14	17,917	+77	59	+8	0.33%	40.8%
2026-10-13	17,840	−256	51	−23	0.29%	25.8%
2026-10-12	18,096	−32	74	−7	0.41%	25.5%
2026-10-08	18,128	+43	81	−29	0.45%	31.5%
2026-10-07	18,085	−54	110	+18	0.61%	31.4%
2026-10-06	18,139	−169	92	+3	0.51%	35.5%
2026-10-05	18,308	+53	89	−25	0.49%	28.2%
2026-10-02	18,255	+369	114	+1	0.62%	38.0%
2026-10-01	17,886	+59	113	+8	0.63%	34.5%
2026-09-30	17,827	−79	105	−2	0.59%	33.1%
2026-09-29	17,906	+22	107	−16	0.60%	35.7%
2026-09-24	17,884	+70	123	−49	0.69%	40.7%
2026-09-23	17,814	−400	172	−3	0.97%	45.3%
2026-09-22	18,214	+397	175	+26	0.96%	58.0%
2026-09-21	17,817	+119	149	+64	0.84%	14.7%